Services
The Engineering Unit team supports the Quantum Center groups in the areas of FPGA programming and verification, cryogenics, micro- and nano-fabrication, and PCB- and RF-design.
Expertise
- DSP block implementation
- System controller implementation
- Peripheral interface implementation
- Verification
For more information, please contact Abdulkadir Akin
Expertise
Micro- and nano-fabrication
- Substrate cleaning (RCA1, RCA2, Piranha, HF, solvent)
- Mask fabrication
- UV/DUV photolithography
- Direct laser writing (mask, wafer)
- RIE/ICP etching
- Wet etching (metals, oxides, nitrides and silicon)
- 100 kV electron-beam lithography (pattern generation, fracturing, beam-parameter optimization, PEC)
- Process optimization and custom process development
Thin-film deposition
- HV/UHV magnetron sputtering deposition of metals (Nb, NbTi, Al, Ti, Ta) and metal nitrides
- E-beam deposition of metals (Ti, Cr, Au, Al, Mo, W, Cu) and oxides (SiO2, Al2O3)
- Plasma-enhanced chemical vapour deposition (SiO2, Si3N4)
- Compatible substrates: Small dies up to 4-inch substrates.
Characterization
- Spectroscopic ellipsometry/reflectometry
- Scanning electron microscopy (SEM, EBSD, EDX)
- X-ray diffraction
- Focused ion beam (cross-section imaging, patterning, TEM lamella)
- Atomic force microscopy (AFM)
- Mechanical profilometry
Consultation
- Low-cost fabrication techniques
- Nanoimprint lithography (UV, thermal)
- Stencil lithography
- Colloidal lithography
- Batch processing
For more information, please contact Mohsen Bahrami Panah
Expertise
- FPGA board design
- Peripheral card design
For more information, please contact Peter Clements
Expertise
- technical consultancy in the field of cryogenics, vacuum and mechanical vibration isolation
- selection of materials, components and manufacturing processes for cryogenic and vacuum systems
- design of parts and devices operating in cryogenic and vacuum conditions
- solutions for isolation of mechanical vibrations
For more information, please contact Maciej Dziewiecki